Invention Grant
US08507189B2 Upper layer film forming composition and method of forming photoresist pattern
有权
上层成膜组合物和形成光致抗蚀剂图案的方法
- Patent Title: Upper layer film forming composition and method of forming photoresist pattern
- Patent Title (中): 上层成膜组合物和形成光致抗蚀剂图案的方法
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Application No.: US12442377Application Date: 2007-09-21
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Publication No.: US08507189B2Publication Date: 2013-08-13
- Inventor: Daita Kouno , Hiromitsu Nakashima , Yukio Nishimura
- Applicant: Daita Kouno , Hiromitsu Nakashima , Yukio Nishimura
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2006-262214 20060927; JP2007-022828 20070201
- International Application: PCT/JP2007/068399 WO 20070921
- International Announcement: WO2008/038590 WO 20080403
- Main IPC: G03F7/11
- IPC: G03F7/11 ; G03F7/26
Abstract:
An upper layer film forming composition for forming an upper layer film on the surface of a photoresist film includes (A) a resin dissolvable in a developer for the photoresist film and (B) a compound having a sulfonic acid residue group, the composition forming an upper layer film with a receding contact angle to water of 70° or more. The upper layer film forming composition of the present invention can form an upper layer film which has a sufficient transparency and is stably maintained without eluting the components into a medium without being intermixed with a photoresist film, can form a resist pattern with high resolution while effectively suppressing a defect, and can suppress a blob defect.
Public/Granted literature
- US20100040974A1 UPPER LAYER FILM FORMING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN Public/Granted day:2010-02-18
Information query
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