Invention Grant
- Patent Title: Methods of forming a patterned, silicon-enriched developable antireflective material and semiconductor device structures including the same
- Patent Title (中): 形成图案化的富含硅的可显影抗反射材料的方法和包括其的半导体器件结构
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Application No.: US12986806Application Date: 2011-01-07
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Publication No.: US08507191B2Publication Date: 2013-08-13
- Inventor: Dan B. Millward , Yuan He , Lijing Gou , Zishu Zhang , Anton J. deVilliers , Jianming Zhou , Kaveri Jain , Scott Light , Michael Hyatt
- Applicant: Dan B. Millward , Yuan He , Lijing Gou , Zishu Zhang , Anton J. deVilliers , Jianming Zhou , Kaveri Jain , Scott Light , Michael Hyatt
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
Methods of forming a patterned, silicon-enriched developable antireflective material. One such method comprises forming a silicon-enriched developable antireflective composition. The silicon-enriched developable antireflective composition comprises a silicon-enriched polymer and a crosslinking agent. The silicon-enriched polymer and the crosslinking agent are reacted to form a silicon-enriched developable antireflective material that is insoluble and has at least one acid-sensitive moiety. A positive-tone photosensitive material, such as a positive-tone photoresist, is formed over the silicon-enriched developable antireflective material and regions thereof are exposed to radiation. The exposed regions of the positive-tone photosensitive material and underlying regions of the silicon-enriched developable antireflective material are removed. Additional methods are disclosed, as are semiconductor device structures including a silicon-enriched developable antireflective material.
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