Invention Grant
- Patent Title: Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same
- Patent Title (中): 具有设置在半导体衬底的下表面上的光电传感器和设置在半导体衬底的上表面上的透镜单元的成像设备及其制造方法
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Application No.: US13115348Application Date: 2011-05-25
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Publication No.: US08507309B2Publication Date: 2013-08-13
- Inventor: Ichiro Mihara , Takeshi Wakabayashi
- Applicant: Ichiro Mihara , Takeshi Wakabayashi
- Applicant Address: JP Tokyo
- Assignee: Teramikros, Inc.
- Current Assignee: Teramikros, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, P.C.
- Priority: JP2010-123117 20100528
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0203
Abstract:
A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pad via insulating film under the semiconductor substrate, and a columnar electrode as an external connection electrode connected to the wiring line. As a result, as compared with the case where the photoelectric conversion device region and the connection pad connected to the photoelectric conversion device region are formed on the upper surface of the semiconductor substrate, a piercing electrode for connecting the connection pad and the wiring line does not have to be formed in the semiconductor substrate. Thus, the number of steps can be smaller, and a fabrication process can be less restricted.
Public/Granted literature
- US20110291212A1 IMAGING APPARATUS HAVING PHOTOSENSOR AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2011-12-01
Information query
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