Invention Grant
- Patent Title: Method of producing semiconductor device with patterned photosensitive adhesive
- Patent Title (中): 用图案化感光胶制造半导体器件的方法
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Application No.: US13551816Application Date: 2012-07-18
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Publication No.: US08507323B2Publication Date: 2013-08-13
- Inventor: Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
- Applicant: Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JPP2007-313886 20071204
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
Public/Granted literature
- US20120282547A1 PHOTOSENSITIVE ADHESIVE Public/Granted day:2012-11-08
Information query
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