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Invention Grant
US08507805B2 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard 有权
半导体器件，半导体器件，电子设备和主板的接线板

  • Patent Title: Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
  • Patent Title (中): 半导体器件，半导体器件，电子设备和主板的接线板
  • Application No.: US12362670
    Application Date: 2009-01-30
  • Publication No.: US08507805B2
    Publication Date: 2013-08-13
  • Inventor: Seiya Fujii
  • Applicant: Seiya Fujii
  • Applicant Address: JP Tokyo
  • Assignee: Elpida Memory, Inc.
  • Current Assignee: Elpida Memory, Inc.
  • Current Assignee Address: JP Tokyo
  • Agency: Young & Thompson
  • Priority: JP2008-021376 20080131
  • Main IPC: H05K1/16
  • IPC: H05K1/16 ;  H01L21/56
Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
Abstract:
In a wiring board according to the present invention, a substrate, a solder resist provided on the substrate, a land, a wiring line, and a connection portion connecting the wiring line and the land, the connection portion is provided with a recess as a non-flat portion, and is formed to comprise a width greater than a width of the wiring line and smaller than a width (diameter) of the land, the width of the connection portion being gradually increased from the wiring line toward the land.
Abstract(Chinese):

在根据本发明的布线板中，基板，设置在基板上的阻焊剂，焊盘，布线和连接布线和焊盘的连接部分，连接部分设置有作为 非平坦部分，并且形成为包括大于布线的宽度的宽度并且小于焊盘的宽度（直径），连接部分的宽度从布线向着平台逐渐增加。

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