Systems and methods for brazing and soldering using low and non-silver based filler metals are described. The present invention includes methods and systems for brazing and soldering using copper based or bronze type filler metals in lieu of silver containing filler metals. The systems and methods provide advantages in that the bronze filler metals are substantially cheaper than silver alloy filler metals that are commonly used. Furthermore, the present invention uses a low-temperature, water-soluble flux that provides for easier cleanup after the completion of the brazing process. Additionally, the present invention provides significant advantages over traditional copper brazing in that it allows for a one-piece workflow and eliminates the need for large component pieces and filler metal inventories. This results in a significant decrease in capital expenditures and utility costs. Finally, the method described results in a significant decrease in the amount of equipment maintenance and capital investment that is necessary.