Invention Grant
- Patent Title: Pattern measuring method and pattern measuring device
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Application No.: US13457359Application Date: 2012-04-26
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Publication No.: US08507856B2Publication Date: 2013-08-13
- Inventor: Takumichi Sutani , Ryoichi Matsuoka , Hidetoshi Morokuma , Hitoshi Komuro , Akiyuki Sugiyama
- Applicant: Takumichi Sutani , Ryoichi Matsuoka , Hidetoshi Morokuma , Hitoshi Komuro , Akiyuki Sugiyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-049923 20050225
- Main IPC: G06K9/48
- IPC: G06K9/48 ; G06K9/00

Abstract:
A pattern measuring method and device are provided which set a reference position for a measuring point to be measured by a scanning electron microscope and the like, based on position information of a reference pattern on an image acquired from the scanning electron microscope and based on a positional relation, detected by using design data, between the measuring point and the reference pattern formed at a position isolated from the measuring point.
Public/Granted literature
- US20120211653A1 PATTERN MEASURING METHOD AND PATTERN MEASURING DEVICE Public/Granted day:2012-08-23
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