Invention Grant
- Patent Title: Light emitting diode package and method for manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13209448Application Date: 2011-08-15
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Publication No.: US08507934B2Publication Date: 2013-08-13
- Inventor: Chao-Hsiung Chang , Chieh-Ling Chang , Pi-Chiang Hu
- Applicant: Chao-Hsiung Chang , Chieh-Ling Chang , Pi-Chiang Hu
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronics Technology, Inc.
- Current Assignee: Advanced Optoelectronics Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010550947 20101119
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An exemplary light emitting diode (LED) package includes a substrate having a first electrical portion and a second electrical portion formed thereon, two antioxidation layers formed on and electrically connected to the first electrical portion and the second electrical portion, respectively, and an LED chip disposed on the substrate and electrically connected to the two antioxidation layers.
Public/Granted literature
- US20120126264A1 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-05-24
Information query
IPC分类:
