Invention Grant
US08507977B2 Semiconductor device and manufacturing method of the same 失效
半导体器件及其制造方法相同

Semiconductor device and manufacturing method of the same
Abstract:
Disclosed herein is a semiconductor device including: a first conductivity type semiconductor base body; a first conductivity type pillar region; second conductivity type pillar regions; element and termination regions provided in the first and second conductivity type pillar regions, transistors being formed in the element region, and no transistors being formed in the termination region; body regions; a gate insulating film; gate electrodes; source regions; and body potential extraction regions, wherein voids are formed in the second conductivity type pillar regions of the termination region.
Public/Granted literature
Information query
Patent Agency Ranking
0/0