Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
- Patent Title (中): 半导体器件及其制造方法相同
-
Application No.: US13538688Application Date: 2012-06-29
-
Publication No.: US08507977B2Publication Date: 2013-08-13
- Inventor: Yuji Sasaki
- Applicant: Yuji Sasaki
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Chicago Technology Law Group, LLC
- Agent Robert J. Depke
- Priority: JP2009-017155 20090128
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Disclosed herein is a semiconductor device including: a first conductivity type semiconductor base body; a first conductivity type pillar region; second conductivity type pillar regions; element and termination regions provided in the first and second conductivity type pillar regions, transistors being formed in the element region, and no transistors being formed in the termination region; body regions; a gate insulating film; gate electrodes; source regions; and body potential extraction regions, wherein voids are formed in the second conductivity type pillar regions of the termination region.
Public/Granted literature
- US20120267707A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2012-10-25
Information query
IPC分类: