A semiconductor package, a semiconductor device, and a semiconductor module, the semiconductor package including a substrate, the substrate having a plurality of inner pads; a semiconductor chip attached to the substrate, the semiconductor chip being electrically connected to the inner pads; a plurality of lands on the substrate, the plurality of lands being electrically connected to the inner pads; and at least one bypass interconnection on the substrate, wherein the plurality of lands includes a first land and a second land, the bypass interconnection is connected to the first land and the second land, and the first land is spaced apart from the second land by a distance of about three times or greater an average distance between adjacent lands of the plurality of lands.