Invention Grant
- Patent Title: Semiconductor device utilizing a package on package structure and manufacturing method thereof
- Patent Title (中): 利用封装结构的封装的半导体器件及其制造方法
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Application No.: US13298425Application Date: 2011-11-17
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Publication No.: US08508048B2Publication Date: 2013-08-13
- Inventor: Hiroshi Honjo
- Applicant: Hiroshi Honjo
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2010-269105 20101202
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/56 ; H01L21/58
Abstract:
A semiconductor device which includes a substrate, a semiconductor chip which is mounted on the substrate, a package in which an upper surface of the substrate and the semiconductor chip are sealed using an insulating material, and a molding material which is exposed to the upper surface of the package. In addition, the device includes a lead of which one end is connected to the mold material and the other end is electrically connected to the substrate, which is integrally formed of the same material as from a connection portion with the mold material to a connection portion with the substrate, and of which the connection portion with the mold material is exposed to the upper surface of the package.
Public/Granted literature
- US20120139122A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-06-07
Information query
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