Invention Grant
- Patent Title: Surface acoustic wave element, surface acoustic wave device and methods for manufacturing the same
- Patent Title (中): 表面声波元件,声表面波器件及其制造方法
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Application No.: US12542983Application Date: 2009-08-18
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Publication No.: US08508100B2Publication Date: 2013-08-13
- Inventor: Hun Joo Lee , Soosuk Lee , Chinsung Park , Kieun Kim
- Applicant: Hun Joo Lee , Soosuk Lee , Chinsung Park , Kieun Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0109042 20081104; KR10-2008-0135542 20081229
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
A surface acoustic wave (“SAW”) element includes a substrate which is formed of a piezoelectric material, a plurality of first electrodes which are disposed on the substrate and separated from each other, a plurality of second electrodes which are disposed on the substrate and are separated from the first electrodes and are separated from each other, and oxide films which are disposed on the respective plurality of first electrodes and the plurality of second electrodes.
Public/Granted literature
- US20100109475A1 SURFACE ACOUSTIC WAVE ELEMENT, SURFACE ACOUSTIC WAVE DEVICE AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2010-05-06
Information query
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