A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanism 20 is used where positions of arrangement of substrate support positions along the direction perpendicular to a scan direction by a plurality of first supports 23a to 23d are set outside the image capturing ranges of the substrate 10 by the imaging units 30a, 30b at the first relative position and inside the common image capturing range and where positions of arrangement of substrate support positions along the direction perpendicular to the scan direction by the plurality of second supports 24a to 24d are set outside the image capturing ranges of the substrate by the imaging units at the second relative position and inside the common image capturing range. The surface of the substrate 10 supported by the plurality of first supports is scanned and captured by the imaging units at the first relative position, the imaging units are moved to the second relative position, then the surface of the substrate 10 supported by the plurality of second supports is scanned and captured by the imaging units at the second relative position.