Invention Grant
- Patent Title: Cap assembly
- Patent Title (中): 盖组件
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Application No.: US12766264Application Date: 2010-04-23
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Publication No.: US08508416B2Publication Date: 2013-08-13
- Inventor: Laurian P. Chirila , Iain C. Roy
- Applicant: Laurian P. Chirila , Iain C. Roy
- Applicant Address: CA Mississauga, Ontario
- Assignee: Psion Inc.
- Current Assignee: Psion Inc.
- Current Assignee Address: CA Mississauga, Ontario
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
A cap assembly attachable to a main housing of a handheld device. The cap assembly includes a cap body at least partially defining one or more cavities therein, and one or more WAN antennas receivable in the cavity. In addition, the cap assembly includes an electromagnetic shield receivable in the cavity for providing each WAN antenna with a predetermined electromagnetic environment in which the impedances of the WAN antenna and the electromagnetic shield are substantially matched.
Public/Granted literature
- US20110260930A1 CAP ASSEMBLY Public/Granted day:2011-10-27
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