Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US13553107Application Date: 2012-07-19
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Publication No.: US08508888B2Publication Date: 2013-08-13
- Inventor: Tetsuya Ohsawa
- Applicant: Tetsuya Ohsawa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2011-160163 20110721; JP2011-180972 20110822
- Main IPC: G11B5/60
- IPC: G11B5/60

Abstract:
A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.
Public/Granted literature
- US20130021699A1 SUSPENSION BOARD WITH CIRCUIT Public/Granted day:2013-01-24
Information query
IPC分类: