Invention Grant
- Patent Title: Electronic component and substrate module
- Patent Title (中): 电子部件和基板模块
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Application No.: US13359524Application Date: 2012-01-27
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Publication No.: US08508911B2Publication Date: 2013-08-13
- Inventor: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-016825 20110128
- Main IPC: H01G4/005
- IPC: H01G4/005

Abstract:
A multilayer body includes first and second capacitance conductors and an internal conductor, which define a capacitor, provided therein. First and second external electrodes are respectively connected to the first and second capacitance conductors via first and second led out conductors. The internal conductor faces the first and second capacitance conductors. Third and fourth external electrodes are connected to the first capacitance conductor via third and fourth led out conductors. Fifth and sixth external electrodes are connected to the second capacitance conductor via fifth and sixth led out conductors.
Public/Granted literature
- US20120194965A1 ELECTRONIC COMPONENT AND SUBSTRATE MODULE Public/Granted day:2012-08-02
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