Invention Grant
- Patent Title: Ceramic electronic component and method of manufacturing ceramic electronic component
- Patent Title (中): 陶瓷电子元件及其制造方法
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Application No.: US13025792Application Date: 2011-02-11
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Publication No.: US08508914B2Publication Date: 2013-08-13
- Inventor: Toshio Sakurai , Hisashi Kobuke , Tomohiro Arashi , Takahiro Nakano , Yasuharu Miyauchi
- Applicant: Toshio Sakurai , Hisashi Kobuke , Tomohiro Arashi , Takahiro Nakano , Yasuharu Miyauchi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2010-080387 20100331
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.
Public/Granted literature
- US20110242728A1 CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT Public/Granted day:2011-10-06
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