An enclosure assembly and system are provided for implementing cover-mounted, auto-docking for multiple DASD configurations in information technology equipment. A user selected direct access storage device (DASD) configuration is mechanically attached to an enclosure cover. A cover interposer card is mechanically attached to the enclosure cover and electrically connected to each DASD in the user selected DASD configuration. An electrical connector mates with the cover interposer card as the cover is installed through a sliding motion with a chassis and base planar of the enclosure assembly. A flexible cable interconnect attached to the mating electrical connector is connected to the base planar. The enclosure assembly enables high density, high performance modular server architectures without compromising processor performance or planar electrical architecture.