Invention Grant
- Patent Title: Fan assembly with flex printed circuit board
- Patent Title (中): 风扇组件带柔性印刷电路板
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Application No.: US13172982Application Date: 2011-06-30
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Publication No.: US08508941B2Publication Date: 2013-08-13
- Inventor: Glenn C Simon , Teri F Verschoor
- Applicant: Glenn C Simon , Teri F Verschoor
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis. Alternatively, an apparatus includes a chassis having a PCA disposed inside the chassis; and a fan assembly, the fan assembly including a housing; a plurality of fan units mounted in the housing; and a flex PCB having a first portion, the first portion of the flex PCB being arranged parallel to a surface of the housing and being electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a PCA, the PCA having mounted thereon a connector connected to the PCA disposed within the chassis.
Public/Granted literature
- US20130003298A1 FAN ASSEMBLY WITH FLEX PRINTED CIRCUIT BOARD Public/Granted day:2013-01-03
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