A communication apparatus includes first and second housings connected to each other by a hinge mechanism. The first housing includes a first substrate having electronic components electrically connected to an antenna, a first hinge portion configuring a portion of the hinge mechanism, and a first conductive member provided in the first hinge portion. The second housing includes a second substrate having electronic components, a waterproofing partition wall surrounding the second substrate, a second hinge portion configuring a portion of the hinge mechanism, a second conductive member provided in the second hinge portion to be capacitively-coupled with the first conductive member, and a third conductive member insertion-molded therein. The third conductive member includes an inner portion positioned on an inner side of the partition wall, and an outer portion extending from the inner portion toward an outer side of the partition wall and capacitively-coupled with the second conductive member.