Invention Grant
- Patent Title: Multiple micro HF-contact arrangement
- Patent Title (中): 多重微型HF接触装置
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Application No.: US12677564Application Date: 2008-08-11
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Publication No.: US08508949B2Publication Date: 2013-08-13
- Inventor: Bernd Rosenberger
- Applicant: Bernd Rosenberger
- Applicant Address: DE Fridolfing
- Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Current Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Current Assignee Address: DE Fridolfing
- Agency: DeLio & Peterson, LLC
- Agent Robert Curcio
- Priority: DE202007012719U 20070911
- International Application: PCT/EP2008/006606 WO 20080811
- International Announcement: WO2009/033538 WO 20090319
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
The invention relates to a multiple micro HF-contact arrangement with HF-connections for passing through or contacting in a housing opening or in a duct, in particular at the transition from coaxial line or microstrip line to a coplanar line. The HF-connection thus comprises at least two circuit boards arranged in a plane which may be connected to each other by means of a planar contact pin on one circuit board and at least one planar socket on the other circuit board.
Public/Granted literature
- US20100302751A1 Multiple Micro HF-Contact Arrangement Public/Granted day:2010-12-02
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