Invention Grant
US08508950B2 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise 有权
包括用于抑制电力和接地平面噪声的结构的基板,系统和装置,以及用于抑制电力和接地平面噪声的方法

  • Patent Title: Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
  • Patent Title (中): 包括用于抑制电力和接地平面噪声的结构的基板,系统和装置,以及用于抑制电力和接地平面噪声的方法
  • Application No.: US12842637
    Application Date: 2010-07-23
  • Publication No.: US08508950B2
    Publication Date: 2013-08-13
  • Inventor: Houfei ChenShiyou Zhao
  • Applicant: Houfei ChenShiyou Zhao
  • Applicant Address: US ID Boise
  • Assignee: Micron Technology, Inc.
  • Current Assignee: Micron Technology, Inc.
  • Current Assignee Address: US ID Boise
  • Agency: TraskBritt
  • Main IPC: H05K1/18
  • IPC: H05K1/18
Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
Abstract:
Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The at least one noise suppression structure may include a power plane extension that extends from the power plane generally toward the ground plane, and a ground plane extension that extends from the ground plane generally toward the power plane. The ground plane extension may be separated from the power plane extension by a distance that is less than the distance separating the power and ground planes. Electronic device assemblies and systems include such substrates. Methods for suppressing noise in at least one of a power plane and a ground plane include providing such noise suppression structures between power and ground planes.
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