Invention Grant
- Patent Title: Electrical assembly
- Patent Title (中): 电气组装
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Application No.: US12714719Application Date: 2010-03-01
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Publication No.: US08508952B2Publication Date: 2013-08-13
- Inventor: Beatrice Bonvalot
- Applicant: Beatrice Bonvalot
- Applicant Address: FR Meudon
- Assignee: Gemalto S.A.
- Current Assignee: Gemalto S.A.
- Current Assignee Address: FR Meudon
- Agency: Cozen O'Connor
- Priority: FR0110483 20010803
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12

Abstract:
An electrical device that is electrically and mechanically connectable to another electrical device includes a face equipped with contact pads. An adhesive layer is on the face equipped with the contact pads. The adhesive layer is composed of a substance with adhesive properties. A plurality of openings through the adhesive are layer over each contact pad, and small metal sticks which have been grown electrolessly or electrochemically are in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.
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