Invention Grant
US08509622B2 Optical module and optical communication system 有权
光模块和光通信系统

Optical module and optical communication system
Abstract:
The present disclosure discloses an optical module and optical communication system. The optical module includes an upper housing (210), a printed circuit board (220), and an integrated chip (240) and an optical transceiver module (250) arranged on the printed circuit board, the upper housing (210) and the lower housing (230) together forming a space accommodating the printed circuit board (220), the integrated circuit board (240), and the optical transceiver module (250), and a first flexible thermally conductive component (260) arranged between the printed circuit board (220) and the lower housing (230). One surface of the first flexible thermally conductive component (260) is contacted with the integrated chip (240), and another surface of the first flexible thermally conductive component (260) is contacted with the lower housing (230). The optical module provided by the present disclosure has good heat dissipation performance and relatively high reliability.
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