Invention Grant
- Patent Title: Optical module and optical communication system
- Patent Title (中): 光模块和光通信系统
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Application No.: US13050634Application Date: 2011-03-17
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Publication No.: US08509622B2Publication Date: 2013-08-13
- Inventor: Yangfan Zhong
- Applicant: Yangfan Zhong
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Brinks Hofer Gilson & Lione
- Priority: CN201010187497 20100527; WOPCT/CN2011/070952 20110212
- Main IPC: H04B10/00
- IPC: H04B10/00

Abstract:
The present disclosure discloses an optical module and optical communication system. The optical module includes an upper housing (210), a printed circuit board (220), and an integrated chip (240) and an optical transceiver module (250) arranged on the printed circuit board, the upper housing (210) and the lower housing (230) together forming a space accommodating the printed circuit board (220), the integrated circuit board (240), and the optical transceiver module (250), and a first flexible thermally conductive component (260) arranged between the printed circuit board (220) and the lower housing (230). One surface of the first flexible thermally conductive component (260) is contacted with the integrated chip (240), and another surface of the first flexible thermally conductive component (260) is contacted with the lower housing (230). The optical module provided by the present disclosure has good heat dissipation performance and relatively high reliability.
Public/Granted literature
- US20110293284A1 OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM Public/Granted day:2011-12-01
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