Invention Grant
- Patent Title: Spatial map of mask-pattern defects
- Patent Title (中): 掩模图案缺陷的空间图
-
Application No.: US13313957Application Date: 2011-12-07
-
Publication No.: US08510683B2Publication Date: 2013-08-13
- Inventor: Jun Peng , Guoqiang Bai , Xin Zhou
- Applicant: Jun Peng , Guoqiang Bai , Xin Zhou
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Fenwick & West LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A technique for providing information about defects in a mask pattern is described. In this technique, defects in the mask pattern may be determined based on differences between a calculated pattern produced at an image plane in the photolithographic process, when the mask pattern, illuminated by an associated source pattern, is at an object plane in the photolithographic process, and a target pattern that excludes the defects. Then the defect information may be provided to the user, such as a spatial map of the determined defects, where the spatial map is associated with at least the portion of the mask pattern.
Public/Granted literature
- US20130152026A1 SPATIAL MAP OF MASK-PATTERN DEFECTS Public/Granted day:2013-06-13
Information query