Invention Grant
- Patent Title: Method and mechanism for implementing PCB routing
- Patent Title (中): 实现PCB路由的方法和机制
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Application No.: US11098039Application Date: 2005-04-01
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Publication No.: US08510703B1Publication Date: 2013-08-13
- Inventor: Ken Wadland , Richard Allen Woodward, Jr. , Randall Lawson , Alan G Strelzoff , David Tsai , Steve Russo
- Applicant: Ken Wadland , Richard Allen Woodward, Jr. , Randall Lawson , Alan G Strelzoff , David Tsai , Steve Russo
- Applicant Address: US CA San Jose
- Assignee: Cadence Design Systems, Inc.
- Current Assignee: Cadence Design Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Vista IP Law Group, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method and system for auto-routing wiring within a PCB. In some embodiment, a first broad region within a first layer and a counterpart first broad region within a second layer are defined. The counterpart regions define a first broad via location. In some embodiments, the first and second broad via locations of the first and second layers can then be subdivided into a plurality of triangular regions. The triangular regions on the first and second layers can then be compared to more accurately locate an appropriate via location.
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