Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12073787Application Date: 2008-03-10
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Publication No.: US08510790B2Publication Date: 2013-08-13
- Inventor: Toru Yonebayashi
- Applicant: Toru Yonebayashi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-61745 20070312; JP2008-29049 20080208
- Main IPC: H04L29/06
- IPC: H04L29/06

Abstract:
The object of the present invention is to provide a substrate processing apparatus and a substrate processing system capable of performing an appropriate processing in response to the operating condition of the substrate processing apparatus and of realizing an improvement in the availability rate of the apparatus. The substrate processing apparatus includes: storage section for storing a plurality of recipes describing a procedure for processing a substrate and operating authorities of a user corresponding to the plurality of recipes; and display section for displaying an authority setting screen for setting the operating authorities of the user to the respective recipes and an edition screen for editing a recipe stored in the storage section on the basis of the operating authority set via the authority setting screen. The substrate processing apparatus can edit the authority setting screen displayed by the display section and can set different operating authorities to the recipe between when the operating condition of the substrate processing apparatus is online and when the operating condition of the substrate processing apparatus is offline.
Public/Granted literature
- US20080229386A1 Substrate processing apparatus Public/Granted day:2008-09-18
Information query