Invention Grant
US08519272B2 Suspension substrate, manufacturing method of suspension substrate, suspension, device-mounted suspension, and hard disk drive 有权
悬挂基板,悬架基板的制造方法,悬架,装置悬挂和硬盘驱动器

  • Patent Title: Suspension substrate, manufacturing method of suspension substrate, suspension, device-mounted suspension, and hard disk drive
  • Patent Title (中): 悬挂基板,悬架基板的制造方法,悬架,装置悬挂和硬盘驱动器
  • Application No.: US13053349
    Application Date: 2011-03-22
  • Publication No.: US08519272B2
    Publication Date: 2013-08-27
  • Inventor: Masao Ohnuki
  • Applicant: Masao Ohnuki
  • Applicant Address: JP Tokyo-to
  • Assignee: Dai Nippon Printing Co., Ltd.
  • Current Assignee: Dai Nippon Printing Co., Ltd.
  • Current Assignee Address: JP Tokyo-to
  • Agency: Ladas & Parry LLP
  • Priority: JP2010-067469 20100324
  • Main IPC: H05K1/00
  • IPC: H05K1/00
Suspension substrate, manufacturing method of suspension substrate, suspension, device-mounted suspension, and hard disk drive
Abstract:
The object of the present invention is to provide a suspension substrate such that the thickness of an insulating layer for supporting a connecting terminal having a flying structure is uniform. The present invention attains the object by providing a suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein a wiring layer projecting section is provided by a plurality; an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections; and a gap between a first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between a second outermost wiring layer projecting section and the second adjusting section are equal.
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