Invention Grant
US08520343B2 Suspension board with circuit having an opening formed in the metal supporting board at a slider mounting region
有权
具有电路的悬挂板，其具有在滑块安装区域处形成在金属支撑板中的开口
- Patent Title: Suspension board with circuit having an opening formed in the metal supporting board at a slider mounting region
- Patent Title (中): 具有电路的悬挂板，其具有在滑块安装区域处形成在金属支撑板中的开口
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Application No.: US13067148Application Date: 2011-05-12
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Publication No.: US08520343B2Publication Date: 2013-08-27
- Inventor: Jun Ishii
- Applicant: Jun Ishii
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2010-116595 20100520
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region.
Public/Granted literature
- US20110286132A1 Suspension board with circuit and producing method thereof Public/Granted day:2011-11-24
Information query
IPC分类:
