Invention Grant
US08522506B2 System for the placement of modular fill material forming co-joined assemblies
失效
用于放置模块化填充材料成型共连组件的系统
- Patent Title: System for the placement of modular fill material forming co-joined assemblies
- Patent Title (中): 用于放置模块化填充材料成型共连组件的系统
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Application No.: US13473402Application Date: 2012-05-16
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Publication No.: US08522506B2Publication Date: 2013-09-03
- Inventor: Robert T. Barnet , Bradley J. Barnet , Donald H. Dworkes
- Applicant: Robert T. Barnet , Bradley J. Barnet , Donald H. Dworkes
- Applicant Address: US CO Fort Collins
- Assignee: ThermoFormed Block Corp.
- Current Assignee: ThermoFormed Block Corp.
- Current Assignee Address: US CO Fort Collins
- Agency: Santangelo Law Offices, P.C.
- Main IPC: E04B2/26
- IPC: E04B2/26 ; E04B2/84
Abstract:
A system for the placement of modular fill material forming co-joined assemblies that promotes increased efficiency in fill material building methods by utilizing the capabilities of aerial conveyance devices, the pre-assembly of forms, the rapid bracing of forms, and the sequential placement of enclosure forms.
Public/Granted literature
- US20120222384A1 System for the Placement of Modular Fill Material Forming Co-Joined Assemblies Public/Granted day:2012-09-06
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