Invention Grant
- Patent Title: Bistable cover assemblies
- Patent Title (中): 双稳态盖组件
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Application No.: US13149386Application Date: 2011-05-31
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Publication No.: US08523010B2Publication Date: 2013-09-03
- Inventor: Josep Ortiz Mompel , Ismael Chanclon Fernandez , Eduardo Martin Orue
- Applicant: Josep Ortiz Mompel , Ismael Chanclon Fernandez , Eduardo Martin Orue
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B65D43/14
- IPC: B65D43/14 ; B65D43/18 ; B65D43/22 ; B65D43/24 ; B65D51/04

Abstract:
In one example, a bistable cover assembly includes a cover, a base, an intermediate part; and pre-tensioned spring, the spring being attached to the base and the intermediate part such that the spring biases the intermediate part into two stable positions, the cover interfacing with the intermediate part and being closed in a first of the two stable positions and open in a second of the two stable positions. A method for assembling a cover assembly is also described.
Public/Granted literature
- US20120305583A1 BISTABLE COVER ASSEMBLIES Public/Granted day:2012-12-06
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