Invention Grant
US08523080B2 Memory card package structure and method for fabricating the same 有权
存储卡封装结构及其制造方法

Memory card package structure and method for fabricating the same
Abstract:
A memory card package structure includes a substrate having an antenna module; a first and second magnetic waveguiding layers respectively disposed on an upper surface and a lower surface of the substrate; a chip disposed on the first magnetic waveguiding layer and electrically connected with the substrate; and an encapsulation body encapsulating the chip, the first magnetic waveguiding layer and the upper surface of the substrate. A method for fabricating the memory card package structure is also provided. By directly disposing magnetic waveguiding material in the package structure, the thickness of the package structure is retained and yet the signal of an antenna module in the memory card package structure can be directed out along a horizontal direction, thereby extending the signal transmission distance.
Public/Granted literature
Information query
Patent Agency Ranking
0/0