Invention Grant
- Patent Title: Memory card package structure and method for fabricating the same
- Patent Title (中): 存储卡封装结构及其制造方法
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Application No.: US13196144Application Date: 2011-08-02
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Publication No.: US08523080B2Publication Date: 2013-09-03
- Inventor: Wen-Hsiang Lien
- Applicant: Wen-Hsiang Lien
- Applicant Address: TW Hsin-Chu
- Assignee: Aptos Technology Inc.
- Current Assignee: Aptos Technology Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW99131007A 20100914
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A memory card package structure includes a substrate having an antenna module; a first and second magnetic waveguiding layers respectively disposed on an upper surface and a lower surface of the substrate; a chip disposed on the first magnetic waveguiding layer and electrically connected with the substrate; and an encapsulation body encapsulating the chip, the first magnetic waveguiding layer and the upper surface of the substrate. A method for fabricating the memory card package structure is also provided. By directly disposing magnetic waveguiding material in the package structure, the thickness of the package structure is retained and yet the signal of an antenna module in the memory card package structure can be directed out along a horizontal direction, thereby extending the signal transmission distance.
Public/Granted literature
- US20120061474A1 MEMORY CARD PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-03-15
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