Invention Grant
- Patent Title: Board fixing structure
- Patent Title (中): 板固定结构
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Application No.: US13133081Application Date: 2009-12-16
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Publication No.: US08523117B2Publication Date: 2013-09-03
- Inventor: Hideyuki Hirota
- Applicant: Hideyuki Hirota
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-086446 20090331
- International Application: PCT/JP2009/006924 WO 20091216
- International Announcement: WO2010/113234 WO 20101007
- Main IPC: G12B9/00
- IPC: G12B9/00

Abstract:
A protrusion 31 formed at an end edge of a board that is not screw-fixed is inserted into a rectangular opening engaging section 25 formed on a chassis 2, sides of the board are mounted on a screw-fixing section (also serving as a board receiver) 21, and a first and a second board receiving sections 22, 26 that are formed on the chassis 2 by a cutting and raising manner, respectively, the board 3 is gripped by board gripping sections 23a, 23b, and one side of the board 3 is screw-fixed to the screw-fixing section (also serving as the board receiver) 21.
Public/Granted literature
- US20110248132A1 BOARD FIXING STRUCTURE Public/Granted day:2011-10-13
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