Invention Grant
- Patent Title: Mounting of subframe
- Patent Title (中): 安装子框架
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Application No.: US12948069Application Date: 2010-11-17
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Publication No.: US08523258B2Publication Date: 2013-09-03
- Inventor: Shosuke Ohhama , Tetsuya Miyahara , Daisuke Fukunaga
- Applicant: Shosuke Ohhama , Tetsuya Miyahara , Daisuke Fukunaga
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JP2009-264304 20091119; JP2009-264322 20091119
- Main IPC: B62D24/02
- IPC: B62D24/02 ; B62D33/10
Abstract:
In a structure for mounting a subframe, located under a vehicle body, to the vehicle body via an elastic assembly, the elastic assembly includes: a first mounting member located under the vehicle body and over the subframe; a second mounting member located immediately above the first mounting member; and an elastic member disposed between the first and second mounting members. The first mounting member is mounted to the vehicle body, while the second mounting member is mounted to the subframe.
Public/Granted literature
- US20110115258A1 MOUNTING OF SUBFRAME Public/Granted day:2011-05-19
Information query
IPC分类:
