Invention Grant
- Patent Title: Device housing
- Patent Title (中): 设备外壳
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Application No.: US13212203Application Date: 2011-08-18
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Publication No.: US08523396B2Publication Date: 2013-09-03
- Inventor: Chia-Chi Chung
- Applicant: Chia-Chi Chung
- Applicant Address: TW Hsin-Chu
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Jianq Chyun IP Office
- Priority: CN201010567644 20101129
- Main IPC: F21V33/00
- IPC: F21V33/00

Abstract:
A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.
Public/Granted literature
- US20120133252A1 DEVICE HOUSING Public/Granted day:2012-05-31
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