An apparatus for transferring and securing a substrate is shown. A pressure source is provided that is adapted to provide positive and negative pressure. A vacuum chuck is provided having a top side with a plurality of vacuum chuck portals formed therein. Each vacuum chuck portal is in fluid communication with the pressure source. The substrate is secured to the top side of the vacuum chuck when the pressure source provides negative pressure to the vacuum chuck portals. An intermediate member that selectively cooperates with the vacuum chuck to support and transfer the substrate between the vacuum chuck and the intermediate member is provided. The intermediate member has a plurality of receiving spaces and a plurality of transfer members. The receiving spaces and transfer members are adjacent to one another in an alternating pattern, and each transfer member has a top side with a plurality of transfer member portals formed therein. Each transfer member portal is in fluid communication with the pressure source. A carriage extending along at least a portion of the periphery of the vacuum chuck and along at least a portion of the periphery of the intermediate member is provided. The carriage engages at least a portion of the substrate when the pressure source provides positive pressure to the vacuum chuck portals and transfer member portals to transfer the substrate between the intermediate member and the vacuum chuck.