Invention Grant
US08523556B2 Injection blow molding system with enhanced parison body mold configuration
有权
注塑吹塑系统,具有增强型坯体模具配置
- Patent Title: Injection blow molding system with enhanced parison body mold configuration
- Patent Title (中): 注塑吹塑系统,具有增强型坯体模具配置
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Application No.: US12951910Application Date: 2010-11-22
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Publication No.: US08523556B2Publication Date: 2013-09-03
- Inventor: Randal L. Fields , Bruce A. Wardlow , David A. Brunson
- Applicant: Randal L. Fields , Bruce A. Wardlow , David A. Brunson
- Applicant Address: US MO Lee's Summit
- Assignee: R&D Tool & Engineering Co.
- Current Assignee: R&D Tool & Engineering Co.
- Current Assignee Address: US MO Lee's Summit
- Agency: Hovey Williams LLP
- Main IPC: B29C49/06
- IPC: B29C49/06 ; B29C49/64

Abstract:
An injection blow molding (IBM) system and method for forming a plurality of parisons and molded articles. The IBM system includes an injection station having two die sets and a plurality of first and second body mold halves each attached to a respective die set. Each of the first body mold halves has a corresponding second body mold half with which it cooperatively defines a cavity for forming the exterior shape of the body of one of the parisons. The individual, independent attachment of the body mold halves to the die sets allows easy individual replacement of faulty or worn molds. Further, such an attachment configuration also permits the body mold halves connected to a common die set to be spaced from one another, so as to reduce thermal expansion problems and ease dimensional tolerances required for the width of the body mold halves.
Public/Granted literature
- US20120126463A1 INJECTION BLOW MOLDING SYSTEM WITH ENHANCED PARISON BODY MOLD CONFIGURATION Public/Granted day:2012-05-24
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