Invention Grant
- Patent Title: Header connector assembly
- Patent Title (中): 接头连接器总成
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Application No.: US13097123Application Date: 2011-04-29
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Publication No.: US08523581B2Publication Date: 2013-09-03
- Inventor: Galen M. Martin , Joe Sakai , Naomi Ishikawa , Matthew Bryan Hitchcock
- Applicant: Galen M. Martin , Joe Sakai , Naomi Ishikawa , Matthew Bryan Hitchcock
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A header connector assembly and a process of fabricating a header connector assembly is disclosed. The header connector assembly includes a header subassembly and a module. The header subassembly includes an outer housing and an inner housing, the inner housing having contacts and a circuit board, wherein the circuit board is attached to the header subassembly.
Public/Granted literature
- US20120276761A1 HEADER CONNECTOR ASSEMBLY Public/Granted day:2012-11-01
Information query
