Invention Grant
- Patent Title: Electronic module with improved latch mechanism
- Patent Title (中): 具有改进的闩锁机构的电子模块
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Application No.: US13349903Application Date: 2012-01-13
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Publication No.: US08523595B2Publication Date: 2013-09-03
- Inventor: Jerry Wu
- Applicant: Jerry Wu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R13/627
- IPC: H01R13/627

Abstract:
An electronic module (100) for mating with a complementary connector, comprises: a housing defining a recess area and a printed circuit board (3) disposed in the housing. A slider member (61) is assembled to an exterior surface of the housing and defines a pair of curved arm portions (612) formed on a front section thereof and a connecting portion (613) connected with two front ends of the pair of curved arm portions, and each arm portion defines a protrudent portion (6120) formed on a top surface thereof. A gasket (5) is received into the recess area and engaged with the housing. Whereby movement of the slider by a user along a front to rear direction, the pair of curved arm portions are both straightened to make two protrudent portions moved upwardly.
Public/Granted literature
- US20120190223A1 ELECTRONIC MODULE WITH IMPROVED LATCH MECHANISM Public/Granted day:2012-07-26
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