Invention Grant
- Patent Title: Laminate assembly sealing method and arrangement
- Patent Title (中): 层压组装密封方法和布置
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Application No.: US12546765Application Date: 2009-08-25
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Publication No.: US08524028B2Publication Date: 2013-09-03
- Inventor: Robert G. Barnett , Jorge E. Hidalgo
- Applicant: Robert G. Barnett , Jorge E. Hidalgo
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrnad Space Systems International, Inc.
- Current Assignee: Hamilton Sundstrnad Space Systems International, Inc.
- Current Assignee Address: US CT Windsor Locks
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: H01M8/24
- IPC: H01M8/24 ; H01M2/08
Abstract:
An example method of sealing a laminate assembly includes preloading a laminate assembly having a plurality of laminations, pressurizing the laminate assembly, and pressurizing an enclosed volume disposed adjacent an end portion of the laminate assembly to hold the laminations in sealed positions.
Public/Granted literature
- US20110048616A1 LAMINATE ASSEMBLY SEALING METHOD AND ARRANGEMENT Public/Granted day:2011-03-03
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