Invention Grant
- Patent Title: Method of treating paper forming wire surface
- Patent Title (中): 造纸线表面处理方法
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Application No.: US13214708Application Date: 2011-08-22
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Publication No.: US08524042B2Publication Date: 2013-09-03
- Inventor: Fushan Zhang , Tien-Feng Ling
- Applicant: Fushan Zhang , Tien-Feng Ling
- Applicant Address: US DE Wilmington
- Assignee: Hercules Incorporated
- Current Assignee: Hercules Incorporated
- Current Assignee Address: US DE Wilmington
- Agent Joanne Rossi; Shaorong Chen; Michael J. Herman
- Main IPC: D21F1/30
- IPC: D21F1/30 ; D21H21/02 ; D21H17/57 ; D21H17/44 ; D21H17/54

Abstract:
A method for inhibiting resinous and sticky substances from filling or forming deposits on or within papermaking forming wire, by applying to said wire an effective inhibiting amount of a composition comprising at least one cationic agent selected from the group consisting of (a) cationic polyureas, (b) hydrophobically modified cationic polymers, (c) alkylammonium or/and alkylimidazolium salts, and optionally at least one nonionic amphiphilic copolymer selected from (i) hydrophobically modified polyethylene glycols], (ii) hydrophobically modified cellulose ethers, (iii) copolymers of vinyl alcohol and vinyl alkonate, (iv) polyoxyalkylene block copolymers, and (v) hydrophilically modified polydimethylsiloxanes.
Public/Granted literature
- US20120043040A1 Method of Treating Paper Forming Wire Surface Public/Granted day:2012-02-23
Information query