Invention Grant
- Patent Title: Loading device and sputtering device using same
- Patent Title (中): 装载装置和溅射装置
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Application No.: US13091136Application Date: 2011-04-21
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Publication No.: US08524054B2Publication Date: 2013-09-03
- Inventor: Chung-Pei Wang
- Applicant: Chung-Pei Wang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW099145756 20101224
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C14/00 ; C25B9/00 ; C25B11/00 ; C25B13/00 ; B23Q3/18 ; B25B1/06 ; B25B1/16

Abstract:
A sputtering device includes a main body and a loading device received in the main body. The main body includes a top portion, a bottom portion, and a sidewall connected between the top portion and the bottom portion, an upper bearing mounted on the top portion, and a lower bearing mounted on the bottom portion. The loading device includes an outer frame, an inner frame received in the outer frame, and a gear device arranged between the outer frame and the in inner frame. The outer frame is rotatably connected to the upper bearing and includes a plurality of first rods arranged in a first circle. The inner frame is rotatably connected to the lower bearing and includes a plurality of second rods arranged in a second circle. The gear device is configured for bringing the outer frame and the inner frame to rotate in opposite directions.
Public/Granted literature
- US20120160675A1 LOADING DEVICE AND SPUTTERING DEVICE USING SAME Public/Granted day:2012-06-28
Information query
IPC分类: