Invention Grant
- Patent Title: Method for manufacturing a device
- Patent Title (中): 制造装置的方法
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Application No.: US13405478Application Date: 2012-02-27
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Publication No.: US08524313B2Publication Date: 2013-09-03
- Inventor: Hiroki Ohara
- Applicant: Hiroki Ohara
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2003-293837 20030815
- Main IPC: C23C16/448
- IPC: C23C16/448

Abstract:
A method for manufacturing a device, including evaporating a material at a first position, and moving a container that includes the material to a second position, so that an opening of the container is heated at a second temperature higher than a first temperature, the first temperature being a temperature of the opening at the first position, is provided.
Public/Granted literature
- US20120156365A1 DEPOSITION APPARATUS AND MANUFACTURING APPARATUS Public/Granted day:2012-06-21
Information query
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