Invention Grant
- Patent Title: Pipe module
- Patent Title (中): 管道模块
-
Application No.: US13179725Application Date: 2011-07-11
-
Publication No.: US08524345B2Publication Date: 2013-09-03
- Inventor: Yoshio Oozeki , Satoshi Arai , Shigeharu Tsunoda , Taihei Yotsuya , Shizuo Imaoka
- Applicant: Yoshio Oozeki , Satoshi Arai , Shigeharu Tsunoda , Taihei Yotsuya , Shizuo Imaoka
- Applicant Address: JP Tokyo
- Assignee: Hitachi Plant Technologies, Ltd.
- Current Assignee: Hitachi Plant Technologies, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2010-180899 20100812
- Main IPC: B32B1/08
- IPC: B32B1/08 ; B32B15/082 ; B32B15/092

Abstract:
A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.
Public/Granted literature
- US20120040122A1 PIPE MODULE Public/Granted day:2012-02-16
Information query