Invention Grant
US08524438B2 Etch resist solution, method of fabricating thin film pattern using the same and method of fabricating an LCD device using the same
有权
蚀刻抗蚀剂溶液，使用其制造薄膜图案的方法以及使用其制造LCD器件的方法
- Patent Title: Etch resist solution, method of fabricating thin film pattern using the same and method of fabricating an LCD device using the same
- Patent Title (中): 蚀刻抗蚀剂溶液，使用其制造薄膜图案的方法以及使用其制造LCD器件的方法
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Application No.: US11980646Application Date: 2007-10-31
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Publication No.: US08524438B2Publication Date: 2013-09-03
- Inventor: Jin Wuk Kim
- Applicant: Jin Wuk Kim
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2006-0121740 20061204
- Main IPC: G03C1/52
- IPC: G03C1/52
Abstract:
A method of fabricating a thin film pattern improve the life of a blanket and reduce the cost and improve reliability in forming the thin film pattern. The method includes injecting an etch resist solution into a blanket on a printing roller, wherein the etch resist solution includes a printing solvent that satisfies the condition 6>δsolvent or δsolvent>11, where δsolvent is the solubility parameter of the solvent, or satisfies the condition 6
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