Invention Grant
US08524515B2 Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
有权
半导体发光二极管包括在单个半导体管芯上的多个接合焊盘
- Patent Title: Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
- Patent Title (中): 半导体发光二极管包括在单个半导体管芯上的多个接合焊盘
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Application No.: US12938877Application Date: 2010-11-03
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Publication No.: US08524515B2Publication Date: 2013-09-03
- Inventor: John Adam Edmond
- Applicant: John Adam Edmond
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A light emitting device includes a single semiconductor die light emitting diode and at least five bond pads on the single semiconductor die. The bond pads may be in the four corners and at least one midpoint of the single semiconductor die. A wavelength conversion layer may be provided and bond pad extensions may extend through the wavelength conversion layer. Multiple wire bond connections may also be provided.
Public/Granted literature
- US20110042705A1 SEMICONDUCTOR LIGHT EMITTING DIODES INCLUDING MULTIPLE BOND PADS ON A SINGLE SEMICONDUCTOR DIE Public/Granted day:2011-02-24
Information query
IPC分类:
