Invention Grant
- Patent Title: Method for making wafer level image module
- Patent Title (中): 制造晶圆级图像模块的方法
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Application No.: US12539309Application Date: 2009-08-11
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Publication No.: US08524521B2Publication Date: 2013-09-03
- Inventor: Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
- Applicant: Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
- Applicant Address: TW Hsinchu US CA Santa Clara
- Assignee: VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- Current Assignee: VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- Current Assignee Address: TW Hsinchu US CA Santa Clara
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW94134100A 20050929
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
Public/Granted literature
- US20090294639A1 WAFER LEVEL IMAGE MODULE Public/Granted day:2009-12-03
Information query
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