Invention Grant
- Patent Title: Flexible semiconductor package and method for fabricating the same
- Patent Title (中): 柔性半导体封装及其制造方法
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Application No.: US13323061Application Date: 2011-12-12
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Publication No.: US08524530B2Publication Date: 2013-09-03
- Inventor: Min Suk Suh
- Applicant: Min Suk Suh
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0098753 20081008
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A flexible semiconductor package includes a flexible substrate. A data chip is disposed over the flexible substrate. The data chip includes a data storage unit for storing data and first bonding pads that are electrically connected to the data storage unit. A control chip is disposed over the flexible substrate. The control chip includes a data processing unit for processing the data in the data chip and second bonding pads that are electrically connected to the data processing unit. Wirings are formed in order to electrically connect the first bonding pads to the second bonding pads.
Public/Granted literature
- US20120083074A1 FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-04-05
Information query
IPC分类:
