Invention Grant
- Patent Title: Room temperature metal direct bonding
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Application No.: US12913385Application Date: 2010-10-27
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Publication No.: US08524533B2Publication Date: 2013-09-03
- Inventor: Qin-Yi Tong , Paul M. Enquist , Anthony Scot Rose
- Applicant: Qin-Yi Tong , Paul M. Enquist , Anthony Scot Rose
- Applicant Address: US NC Morrisville
- Assignee: Ziptronix, Inc.
- Current Assignee: Ziptronix, Inc.
- Current Assignee Address: US NC Morrisville
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
Public/Granted literature
- US08426248B2 Room temperature metal direct bonding Public/Granted day:2013-04-23
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