Invention Grant
- Patent Title: Resin composition and resin molded product
- Patent Title (中): 树脂组合物和树脂成型品
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Application No.: US12571625Application Date: 2009-10-01
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Publication No.: US08524830B2Publication Date: 2013-09-03
- Inventor: Noritaka Sato , Tsutomu Noguchi
- Applicant: Noritaka Sato , Tsutomu Noguchi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2008-256741 20081001
- Main IPC: C08G63/91
- IPC: C08G63/91 ; C08K5/15 ; C08K5/20

Abstract:
A resin composition includes a polyester capable of forming a crystal structure, and a substance represented by the following general structural formula (1), the substance represented by the following general structural formula (1) has a dehydration-condensed structure of two molecules of natural product-derived α-amino acids or a substitution structure thereof, and the two molecules of α-amino acids are not simultaneously glycine. In the above general structural formula, R1, R2, R3, and R4 indicate groups or substituent groups thereof bonded to the α carbons of the α-amino acids.
Public/Granted literature
- US20100081766A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT Public/Granted day:2010-04-01
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